Dr. Dongjin Kim

Korea Institute of Industrial Technology (KITECH), Republic of Korea

Biography: Dr. Dongjin Kim is a Principal Investigator at the Korea Institute of Industrial Technology (KITECH), Republic of Korea, where he works at the Advanced Packaging Integration Center. He received his Ph.D. in Adaptive Machine Systems from Osaka University, Japan, in 2020. Prior to joining KITECH, he worked as a Senior Engineer at the Production Engineering Research Institute of LG Electronics.

His research focuses on advanced semiconductor and power electronics packaging, with particular emphasis on high-temperature die-attach materials, silver and copper sintering, Cu–Cu bonding, thermal management, double-sided cooling, metallization and interfacial reliability, and thermo-mechanical design of wide-bandgap semiconductor packages. His work integrates materials processing and microstructural characterization with finite-element and computational thermal analysis to understand structure–property–reliability relationships in advanced electronic packaging.

Dr. Kim has authored approximately 80 scientific articles, including more than 70 papers indexed in SCIE journals, with extensive contributions as first or corresponding author.

Prof. Rafiq Noorani

Loyola Marymount University, USA

Biography: Dr. Rafiqul Noorani is a Professor Emeritus of Loyola Marymount University. With a fellowship from National Research Council, he came to America for higher studies. He received his M.Eng. and Ph.D. from Texas A&M University. He taught engineering at Texas A&M, the University of Louisiana at Lafayette, Gonzaga University before coming to Loyola Marymount University in 1989. His teaching and research interest are in areas of CAD/CAM, Additive Manufacturing and Robotics. He has received over 40 grants totaling over $2 million including six grants from National Science Foundation. He published three books on Additive Manufacturing and over 100 journal and conference papers. He was named Fellow of ASME that recognized his exceptional engineering achievements and contributions to the engineering profession. He a member of ASME and ASEE. He is also the Founder and President of the Osman Ali Noorani Education Foundation in Bangladesh.

Assoc. Prof. Masao Nakagawa

Doshisha University, Japan

Biography: Dr. Nakagawa completed the doctoral program at Doshisha University Graduate School in 2019, receiving a Doctor of Engineering degree. From April of the same year, served as a Researcher in the Automotive Safety Research Division at the National Traffic Safety and Environment Laboratory (NTSEL), and as the Japanese representative to UNECE WP29 GRVA. In 2024, became Associate Professor in the Department of Mechanical Science and Engineering, Faculty of Science and Engineering, Doshisha University, a position held to the present. Engaged in the field of mechatronics, including automation and advancement of manufacturing. Concurrently serves as a Researcher at the Doshisha University Center for Advanced Composite Materials and the Harris Science Research Institute. Also holds positions such as international expert for IEC TC104, Professional Engineer at the Society of Automotive Engineers of Japan (JSAE), and Chair of the Affiliate Committee of the Japan Society for Precision Engineering (JSPE).