Dr. Dongjin Kim

Korea Institute of Industrial Technology (KITECH), Republic of Korea

Biography: Dr. Dongjin Kim is a Principal Investigator at the Korea Institute of Industrial Technology (KITECH), Republic of Korea, where he works at the Advanced Packaging Integration Center. He received his Ph.D. in Adaptive Machine Systems from Osaka University, Japan, in 2020. Prior to joining KITECH, he worked as a Senior Engineer at the Production Engineering Research Institute of LG Electronics.

His research focuses on advanced semiconductor and power electronics packaging, with particular emphasis on high-temperature die-attach materials, silver and copper sintering, Cu–Cu bonding, thermal management, double-sided cooling, metallization and interfacial reliability, and thermo-mechanical design of wide-bandgap semiconductor packages. His work integrates materials processing and microstructural characterization with finite-element and computational thermal analysis to understand structure–property–reliability relationships in advanced electronic packaging.

Dr. Kim has authored approximately 80 scientific articles, including more than 70 papers indexed in SCIE journals, with extensive contributions as first or corresponding author.